02_500gm No Clean Solder Paste

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MOQ : 10 Units

02_500gm No Clean Solder Paste Specification

Composition
63% Tin (Sn), 37% Lead (Pb)

Operating Temperature
Recommended 20C - 24C

Application
PCB Assembly, SMT Soldering

Material
Alloy, Sn63/Pb37

Diameter
Not Applicable (Paste Form)

Flux Content
2.0% 0.2%

Melting Point
183C

Coating
No Clean

Surface Finish
Smooth, Consistent

Shelf Life
6 Months at 10C

Net Weight
500 gm

Color
Gray Paste

Particle Size
25 - 45 m

Residue After Reflow
Minimal, No Cleaning Required

Package Type
Sealed Container

Viscosity
180 20 Pas at 25C

Printing Method
Compatible with Manual and Automatic Stencil Printing

Product Type
No Clean Solder Paste

Storage Conditions
Refrigerate, Avoid Sunlight

02_500gm No Clean Solder Paste Trade Information

Minimum Order Quantity
10 Units

Payment Terms
Cash in Advance (CID)

Supply Ability
5000 Units Per Month

Delivery Time
7 Days

Main Domestic Market
All India

About 02_500gm No Clean Solder Paste

Presenting the 02_500gm No Clean Solder Paste-an uncommonly polished solution for your PCB assembly and SMT soldering needs. Enjoy instant checkout and redeem outstanding value at a reduced price. With its unassailable shelf life of 6 months at 10C and precision-controlled viscosity, this gray paste guarantees a consistent, smooth surface finish. Delivered in a sealed container, the minimal residue after reflow means no cleaning required, streamlining workflow. Compatible with both manual and automatic stencil printing, this solder paste is the preferred choice for manufacturers, suppliers, and traders across India.

Exclusive Features & Versatile Application

The 02_500gm No Clean Solder Paste stands out with its exceptional smooth texture and minimal residue, offering enhanced reliability for intricate PCB assembly. Its graded 25-45 m particle size ensures uniform soldering, whether used with manual or automatic stencil printing. Suitable for both high-volume production and delicate repair, the paste's alloy composition (Sn63/Pb37) provides a perfect melt at 183C, catering to a diverse range of electronics manufacturers and engineers seeking premium quality.

Delivery Details, Sample Availability & Packaging Valuation

Delivery timelines are thoughtfully evaluated based on your location, with quotations promptly provided for precise expenditure planning. We offer trusted, sealed packaging to maintain paste integrity during transit. Samples are available upon request to validate your application needs before full expenditure. Each order receives professional handling, ensuring the 02_500gm No Clean Solder Paste reaches you efficiently and safely for your project's immediate requirements.

FAQ's of 02_500gm No Clean Solder Paste:

Q: How should the 02_500gm No Clean Solder Paste be stored for maximum shelf life?

A: It is best stored refrigerated at 10C, away from sunlight and heat sources, to maintain performance throughout its 6-month shelf life.

Q: What surfaces and applications is this solder paste most suitable for?

A: This no clean solder paste is ideally used in PCB assembly and SMT soldering, suitable for various electronic components and surface finishes.

Q: When can I expect delivery after placing my order?

A: Delivery times depend on your location, but prompt quotations and clear communication facilitate a swift and accurate valuation of your expected receipt date.

Q: Where can I obtain a sample before making a full purchase?

A: Samples are available on request. Simply contact us to discuss your needs and request a sample for expenditure evaluation.

Q: What is the process for redeeming the reduced price offer?

A: Add the product to your cart for instant checkout, where the reduced pricing and any applicable offers are applied automatically.

Q: What usage benefits does the 'no clean' feature offer?

A: With minimal residue post-reflow, the no clean feature eliminates the need for additional cleaning, reducing time and operational expenditure during assembly.

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